Magazine stick is extrusion molded engineering plastic used for mounting, wrapping and packaging of electronic parts such as connectors, semi-conductors, resin molded, metal parts and pressed parts. In addition, the product is pretty durable due to its martial characteristics, and it can be re-used in more times than non-polycarbonate sticks to result in reduction of auxiliary material and waste disposal costs.
for connecting carrier tape
Splicing tape is desined for modular type mounters.
Enable to increase in efficiency and save time from your mounting process by splicing the next carrier tape before the components are finished to be mounted with joint tape.
Insulating moistureproof coating
Comformal coating series
The mounting density of PCBs can be called the heart of electronic appliances and equipment. This mounting density has increasingly become higher to result in the narrowing of space between leads. Furthermore, usage requires PCBs products to stand against a variety of application environments. Some problem causing factors at issue lately are moisture, condensation, oil, detergent, impurities, cohesion of mold, dead insects dust and lead breaks due to vibration have not been addressed adequately at this time. "Seal-glo insulating moistureproof coatings” dries into a thin film at room temperature, while maintaining excellent anti-moisture and insulating properties. This coating will stabilize components as it seals out moisture ( known as conformal coating applied for several types of circuit boards) and numerous types of electronic parts. We are confident that “Seal-glo insulating moisture-proof coatings” will surely enhance the quality and reliability of the electronic equipment that it is applied to.
Adheshive for chip devices NESeries
“Seal-glo NE series” are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities.“Seal-glo NE series” not only have rapid curing properties, with a 1～2 minute heating duration between 90～150℃, as required for SMD mounting, but their fine properties enable them to be applied by both high speed dispensing and screen printing alike. We have a wide range and variety of grades to meet specific customer requirements.
Underfill for BGA / CSP UF Series
In response to consumer demand for even slimmer, more light-weight mobile appliances, the corresponding level of integration needed to meet this requirement led to the development of BGA (Ball Grid Array) and CSP (Chip Size Package) technology, thus replacing previously used QFP (Quad Flat Pack) components. Now in widespread use throughout the electronics industry, BGA and CSP components are connected to the circuit board by means of minute solder balls. However, stresses such as heat cycling, board warping and thermal shock, can sometimes interrupt the connection between the BGA and/or the CSP and the circuit board. To prevent this, Fuji Chemical have developed Seal-glo UF300 Series, an underfill agent which readily penetrates the gaps between the BGA and/or CSP and the circuit board, in turn, contributing to improved bonding reliability. As Seal-glo UF300 Series hardens, it reduces stress and also reinforces the solder bonding. Easily repairable, Seal-glo UF300 Series permits the re-use of expensive electronic parts and circuit boards, thus offering substantial savings.